• DEBORN

Methylhexahydrophthalic anhydride (MHHPA)

Epoxy resin e phekolang, joalo-joalo.

MHHPA ke thermo-setting epoxy resin e folisang e sebelisoang haholo tšimong ea motlakase le electron.


  • Mmala/Hazen:≤20
  • Litaba,%:99.0 Mets
  • Boleng ba Lodine:≤1.0
  • Nomoro ea CAS:25550-51-0
  • Lintlha tsa Sehlahisoa

    Li-tag tsa Sehlahisoa

    Selelekela
    Methylhexahydrophthalic anhydride, MHHPA
    Nomoro ea CAS: 25550-51-0

    Tlhaloso ea Sehlahisoa

    Ponahalo Mokelikeli o senang mmala
    Mmala/Hazen ≤20
    Litaba,% 99.0 Mets.
    Boleng ba Iodine ≤1.0
    Viscosity ( 25℃) 40mPa•s Min 
    Asiti ea Mahala ≤1.0%
    Sebaka se batang ≤-15℃
    Foromo ea Sebopeho C9H12O3

    Litšobotsi tsa 'Mele le Lik'hemik'hale

    Boemo ba 'Mele(25℃) Mokelikeli
    Ponahalo Seela se se nang mmala
    Boima ba Molek'hule 168.19
    Matla a Khoheli (25/4℃) 1.162
    Ho qhibiliha ha Metsi senya
    Solvent Solubility E qhibiliha hanyenyane: petroleum ether Miscible: benzene, toluene, acetone, carbon tetrachloride, chloroform, ethanol, ethyl acetate

    Lisebelisoa
    Epoxy resin e phekolang, joalo-joalo.
    MHHPA ke thermo-setting epoxy resin e folisang e sebelisoang haholo tšimong ea motlakase le electron.Ka melemo e mengata, mohlala, sebaka se tlaase sa ho qhibiliha, viscosity e tlaase ea metsoako e nang le salicylic epoxy resin, nako e telele e sebetsang, ho hanyetsa mocheso o phahameng oa thepa e phekotsoeng le thepa e ntle ea motlakase ka mocheso o phahameng, MHHPA e sebelisoa haholo bakeng sa ho kenya likhoele tsa motlakase, ho lahla. lisebelisoa tsa motlakase le li-semiconductors tse koalang, mohlala, li-insulators tsa ka ntle, li-capacitor, li-diode tse ntšang khanya le pontšo ea digital.

    Ho paka
    E pakiloeng ka meqomong ea polasetiki ea lik'hilograma tse 25 kapa isotank ea tšepe ea 220kg.

    Polokelo
    Boloka libakeng tse pholileng, tse omeletseng 'me u lule hole le mollo le mongobo.


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