Boitsebiso ba Sehlahiswa
Lebitso la sehlahisoa: 6-(2,5-Dihydroxyphenyl) -6H-dibenz[c,e][1,2]oxaphosphorine-6-oxide
CAS NO.: 99208-50-1
Boima ba molek'hule: 324.28
Foromo ea molek'hule: C18H13O4P
Sebopeho sa sebopeho
Thepa
Tekanyo | 1.38-1.4(25℃) |
Sebaka se qhibilihang | 245 ℃ ~ 253 ℃ |
Index ea tekheniki
Ponahalo | Phofo e tšoeu |
Assay(HPLC) | ≥99.1% |
P | ≥9.5% |
Cl | ≤50ppm |
Fe | ≤20ppm |
Kopo
Plamtar-DOPO-HQ ke sesebelisoa se secha sa phosphate halogen-free flame retardant, bakeng sa resin ea boleng bo holimo ea epoxy joalo ka PCB, ho nkela TBBA sebaka, kapa sekhomaretsi bakeng sa semiconductor, PCB, LED joalo-joalo.Bohareng bakeng sa motsoako oa retardant e sebetsang ea lelakabe.
Ho paka le ho Boloka
Boloka sebakeng se phodileng, se omileng.E-ba hōle le mehloli ea mocheso 'me u qobe khanya e tobileng.
20KG / mokotla (mokotla oa pampiri o entsoeng ka polasetiki) kapa ho latela litlhoko tsa bareki.