• DEBORN

Li-DOPO tse sa Reaction Flame tse sa amaneng le Halogen

Li-retant tsa malakabe tse sa sebetseng hantle tse seng tsa Halogen bakeng sa li-resine tsa Epoxy, tse ka sebelisoang ho PCB le semiconductor encapsulation, Sehlahisoa se thibelang bosehla sa ts'ebetso ea motsoako bakeng sa ABS, PS, PP, Epoxy resin le tse ling. Bohareng ba se-retant sa malakabe le lik'hemik'hale tse ling.


  • Lebitso la sehlahisoa:9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide
  • Foromo ea limolek'hule:C12H9O2P
  • Boima ba limolek'hule:216.16
  • NOMORO EA CAS:35948-25-5
  • Qaqiso ea Sehlahisoa

    Li-tag tsa Sehlahisoa

    Boitsebiso ba Sehlahisoa
    Lebitso la sehlahisoa: 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide
    Khutsufatso: DOPO
    NOMORO EA CAS: 35948-25-5
    Boima ba limolek'hule: 216.16
    Foromo ea limolek'hule: C12H9O2P
    Foromo ea sebopeho

    DOPO

    Thepa

    Tekanyo 1.402(30℃)
    Sebaka sa ho qhibiliha 116℃ -120℃
    Sebaka sa ho belisa 200℃ (1mmHg)

    Lenane la tekheniki

    Ponahalo phofo e tšoeu kapa lekhapetla le lesoeu
    Teko (HPLC) ≥99.0%
    P ≥14.0%
    Cl ≤50ppm
    Fe ≤20ppm

    Kopo
    Li-retant tsa malakabe tse sa sebetseng hantle tse seng tsa Halogen bakeng sa li-resine tsa Epoxy, tse ka sebelisoang ho PCB le semiconductor encapsulation, Sehlahisoa se thibelang bosehla sa ts'ebetso ea motsoako bakeng sa ABS, PS, PP, Epoxy resin le tse ling. Bohareng ba se-retant sa malakabe le lik'hemik'hale tse ling.

    Sephutheloana
    25 Kg/mokotla.

    Polokelo
    Boloka sebakeng se pholileng, se omileng, se nang le moea o kenang hantle, hole le oxidizer e matla.


  • E fetileng:
  • E 'ngoe:

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